As described in the attached word file: This study aims to provide a perspective on the current capabilities of Laplace finite difference (LFD) method as a numerical tool to predict component operational temperature in electronic systems. A systematic assessment of predictive accuracy is presented for printed circuit board (PCB)-mounted component heat transfer, using a LFD code dedicated to the thermal analysis of electronic systems. A case study is presented to illustrate the methodology.
I hope writer will read the word documents file as it had all details.
I hope the writer will give a new title for the research.
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